http://arxiv.org/abs/2211.09351
We report on the kinetic inductance detector (KID) array focal plane assembly design for the Terahertz Intensity Mapper (TIM). Each of the 2 arrays consists of 4 wafer-sized dies (quadrants), and the overall assembly must satisfy thermal and mechanical requirements, while maintaining high optical efficiency and a suitable electromagnetic environment for the KIDs. In particular, our design manages to strictly maintain a 50 $\mathrm{\mu m}$ air gap between the array and the horn block. We have prototyped and are now testing a sub-scale assembly which houses a single quadrant for characterization before integration into the full array. The initial test result shows a $>$95\% yield, indicating a good performance of our TIM detector packaging design.
L. Liu, R. Janssen, C. Bradford, et. al.
Fri, 18 Nov 22
35/70
Comments: 8 pages, 6 figures, accepted for publication in Journal of Low Temperature Physics